This report focuses on the future of LTCC. Through studying the development situation in the past five years, analyze the most popular product type, the most promising region, the most potential application and the top players. This report mainly covers five parts (also containing the manufacturing cost analyses, industry chain, traders/dealers/distributors, etc.)
Part One, this report studies the global development state and outlook, focusing the overall situation, involving the total market size (volume and value), growth rate of major regions, top manufacturers, types and applications.
Part Two, this report focuses on the major regions and the most promising regions or countries, involving the production, consumption, export and import of LTCC in major regions, like North America, Europe, China, Japan, Taiwan, Europe, India and Korea etc.
Part Three, this report focuses on the major product types and the most popular type, involving the production, price, revenue, growth rate and market share of each product type, from 2011 to 2015, and forecast from 2016 to 2021, covering the type like LTCC Components, LTCC Substrates and LTCC Module.
Part Four, this report focuses on the major applications and the most potential application, involving the consumption and growth trend of LTCC in each application, covering Consumer Electronics (like Bluetooth; antenna; power amplifier; memorizer; sensor; drives and filters etc.), Aerospace & Military(like Missiles, aviation and aerospace) and Automobile Electronics (like filters, sensors etc.)
Part Five, this report focuses on the top manufacturers, studying the capacity, production, revenue, price, cost, gross margin and market share for each top player, covering Murata(JP), Kyocera(JP), TDK(JP), Taiyo Yuden(JP), KOA Corporation(JP), Yokowo(JP), Hitachi Metals(JP), NIKKO(JP), Soshin Electric(JP), Bosch(DE), IMST GmbH(DE), MST(DE), Via Electronic(DE), Adamant(JP), API Technologies(BE), Selmic(FL), VTT(FL), American Technical Ceramics(US), NEO Tech(US), NTK Technologies(US), Northrop Grumman(US), Samsung Electro-Mechanics(KR), PILKOR CND(KR), ACX Corp(TW), Yageo(TW), Walsin Technology(TW), Darfon Materials(TW), Elit Fine Ceramics(TW), Sunlord(CN), CETC 43rd Institute(CN), CNIGC 214th Institute(CN), ChengDian Electronic(CN), Microgate(CN) and Fenghua Advanced Technology(CN) etc.