The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan

Published: November 2015
No. of Pages: 48

3D IC has the advantages of high density, low power loss and high performance; it utilizes three-dimensional stack architecture to meet the future demand for compact and slim electronic products, and continues Moore's Law of the semiconductor industry. As Taiwan possesses the complete vertical supply chain for semiconductors, the country is suitable for developing three-dimensional stacking technology products, and is helpful in the integration of the semiconductor industry and technology rooting. This report provides an overview of the worldwide 3D IC market, touching on major application and regional markets, and major vendors of 3D IC key components in Taiwan.

List of Topics

  • Overview of the worldwide 3D IC market, touching on the major development trends and market value by application and by region
  • Profile of major Taiwanese 3D IC equipment vendors across the supply chain, including an overview of technology and vendors' deployment at various segments of the supply chain, such as photolithography, dry etching, wet etching, coating, bonding, packaging and testing

Companies covered

Ad-STAC, Air Liquide, Air Product, All Ring Technology, AMAT, Amkore, Apex International, Ares Green Technology, Asahi Pretec Taiwan, Asahi Shih Her Technologies, ASE, ASML, AST, AUO, BOC Edwards, Bosch, C Sun MFG, Camtek, Career Technology, ChangChun PetroChemical, Chemleader, Chilisin Electronics, Chin Poon Industrial, ChipMOS, Compeq Manufacturing, Cyantek, DNP, DNS, Domino Automation Technology, Dow Chemical, Dupont, Dynamic, ECIC, ELS System Technology, EMAX TECH, Epistar, Eternal Materials, Everlight Chemical, EVG, Feedpool Technology, First Hi-tec Enterprise, Founder Technology, Foxconn, Foxsemicon, GMT, Gold Circuit Electronics, Gongin Precision Industrial, GoWorld, GPM, GPTC, HannStar Board, Hermes Microvision, Hermes-Epitek, HiKE, Holtek, Honghow, Hua Jung, Hwasun Quartek, IBM, Innolux, Inotera Memories, INPAQ Technology, ITRI, IV Technologies, Junze, Kaijo, Kaylu Industrial, King Core, Kingyoup, Kinik Company, Kinsus Interconnect Technology, KYO, L&K Engineering, Lasertec, Lextar, Lite-On Technology, LPI, Machvision, Macronix, Marketech International Corp., Maxchip, MEIKO, Merk, Messier-Dowty, MiTAC, Mitsubishi, Mosel Vitelic, MTC, Nan Ya PCB, Nano-Architect Research Corporation, National Cheng Kung University, National Tsing Hua University, NEE, Nichia, Omron, Orbotech, Photronics, Powerchip, Prosys Technology Integration, PSMC, PTI, Rippy, S.E.S. Co. Ltd., Samsung Electro-Mechanics, Scientech, Screen, Shin Her Technology, Shinko, Shira, SHT, Shuz Tung, SMIC, Song Jaan Technology, Sonix, SPIL, Sumitomo, Sun Rise E&T, Sunplus, SUSS, T.N.E.T., Taiwan PCB Techvest, Taiwan Union Technology, TCE, TEL, Tengsen, Tesla Motors, TMC, Top Creation Machines, Toppan, Tripod Technology, TSMC, TSR (Tekstarter), UMC, Unimicron Technology, Unitech, United Integrated Services, UTECHZONE, VIS, VisEra, Walsin, Win Semiconductor, Winbond Electronics, Xintec, YAGEO, Yuhchang Electric, Yulon Group, Zhen Ding Tech

The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan

Table of Contents

1. Worldwide 3D IC Market
1.1 Application Sectors
1.1.1 Consumer Electronics
1.1.2 ICT
1.1.3 Transportation (Automobiles and Aerospace)
1.1.4 Military
1.1.5 Others (Biomedical applications and R&D)
1.2 Regional Markets
1.2.1 North America
1.2.2 Europe
1.2.3 Asia Pacific
1.2.4 Rest of the World
1.3 Summary of the Worldwide 3D IC Market

2. Development of Key 3D IC Component Technologies and Vendors in Taiwan
2.1 Photolithography
2.1.1 Overview of the Technology
2.1.2 Supply Chain Players
2.2 Dry Etching
2.2.1 Overview of the Technology
2.2.2 Supply Chain Players
2.3 Wet Etching/Cleaning
2.3.1 Overview of the Technology
2.3.2 Supply Chain Players
2.4 Coating
2.4.1 Overview of the Technology
2.4.2 Supply Chain Players
2.5 Bonding
2.5.1 Overview of the Technology
2.5.2 Supply Chain Players
2.6 Packaging and Testing
2.6.1 Overview of the Technology
2.6.2 Supply Chain Players
2.7 Summary


Glossary of Terms

List of Companies

List of Figures

Figure 1: Worldwide 3D IC Market Value Contributed by Consumer Electronics Sector
Figure 2: Worldwide 3D IC Market Value Contributed by ICT Sector
Figure 3: Worldwide 3D IC Market Value Contributed by Transportation Sector
Figure 4: Worldwide 3D IC Market Value Contributed by Military Sector
Figure 5: Worldwide 3D IC Market Value Contributed by Other Sectors
Figure 6: Worldwide 3D IC Market in 2012 and 2019 by Application Market
Figure 7: Taiwanese 3D IC Equipment Supply Chain
Figure 8: Temporary Bonding
Figure 9: Laser De-bonding
Figure 10: Illustration of CoWoS

Published By: Market Intelligence & Consulting Institute, MIC
Product Code: Market Intelligence & Consulting Institute, MIC154

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