The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan

Published: November 2015
No. of Pages: 48

3D IC has the advantages of high density, low power loss and high performance; it utilizes three-dimensional stack architecture to meet the future demand for compact and slim electronic products, and continues Moore's Law of the semiconductor industry. As Taiwan possesses the complete vertical supply chain for semiconductors, the country is suitable for developing three-dimensional stacking technology products, and is helpful in the integration of the semiconductor industry and technology rooting. This report provides an overview of the worldwide 3D IC market, touching on major application and regional markets, and major vendors of 3D IC key components in Taiwan.

List of Topics

  • Overview of the worldwide 3D IC market, touching on the major development trends and market value by application and by region
  • Profile of major Taiwanese 3D IC equipment vendors across the supply chain, including an overview of technology and vendors' deployment at various segments of the supply chain, such as photolithography, dry etching, wet etching, coating, bonding, packaging and testing

Companies covered

Ad-STAC, Air Liquide, Air Product, All Ring Technology, AMAT, Amkore, Apex International, Ares Green Technology, Asahi Pretec Taiwan, Asahi Shih Her Technologies, ASE, ASML, AST, AUO, BOC Edwards, Bosch, C Sun MFG, Camtek, Career Technology, ChangChun PetroChemical, Chemleader, Chilisin Electronics, Chin Poon Industrial, ChipMOS, Compeq Manufacturing, Cyantek, DNP, DNS, Domino Automation Technology, Dow Chemical, Dupont, Dynamic, ECIC, ELS System Technology, EMAX TECH, Epistar, Eternal Materials, Everlight Chemical, EVG, Feedpool Technology, First Hi-tec Enterprise, Founder Technology, Foxconn, Foxsemicon, GMT, Gold Circuit Electronics, Gongin Precision Industrial, GoWorld, GPM, GPTC, HannStar Board, Hermes Microvision, Hermes-Epitek, HiKE, Holtek, Honghow, Hua Jung, Hwasun Quartek, IBM, Innolux, Inotera Memories, INPAQ Technology, ITRI, IV Technologies, Junze, Kaijo, Kaylu Industrial, King Core, Kingyoup, Kinik Company, Kinsus Interconnect Technology, KYO, L&K Engineering, Lasertec, Lextar, Lite-On Technology, LPI, Machvision, Macronix, Marketech International Corp., Maxchip, MEIKO, Merk, Messier-Dowty, MiTAC, Mitsubishi, Mosel Vitelic, MTC, Nan Ya PCB, Nano-Architect Research Corporation, National Cheng Kung University, National Tsing Hua University, NEE, Nichia, Omron, Orbotech, Photronics, Powerchip, Prosys Technology Integration, PSMC, PTI, Rippy, S.E.S. Co. Ltd., Samsung Electro-Mechanics, Scientech, Screen, Shin Her Technology, Shinko, Shira, SHT, Shuz Tung, SMIC, Song Jaan Technology, Sonix, SPIL, Sumitomo, Sun Rise E&T, Sunplus, SUSS, T.N.E.T., Taiwan PCB Techvest, Taiwan Union Technology, TCE, TEL, Tengsen, Tesla Motors, TMC, Top Creation Machines, Toppan, Tripod Technology, TSMC, TSR (Tekstarter), UMC, Unimicron Technology, Unitech, United Integrated Services, UTECHZONE, VIS, VisEra, Walsin, Win Semiconductor, Winbond Electronics, Xintec, YAGEO, Yuhchang Electric, Yulon Group, Zhen Ding Tech

Published By: Market Intelligence & Consulting Institute, MIC
Product Code: Market Intelligence & Consulting Institute, MIC154

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