Global (North America, Europe, Asia-Pacific, South America, Middle East and Africa) Lead Frame Market 2018, Forecast to 2023

Published: July 2018
No. of Pages: 145
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Lead Frame, as the foundation of semiconductor packaging material, is a metal frame which provides support for an integrated circuit chip or die, and with the aids of bonding material (wire, aluminum wire, copper wire), lead frame is electrical lead to interconnect the integrated circuit on the die or chip to other electrical components or contacts. The main function of lead frame is for the circuit connection, heat dissipation, mechanical support, and so on.

Scope of the Report:

This report focuses on the Lead Frame in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The global largest market is in China. The market will reached a consumption volume of approximately 232.94 B units in 2016, and the secondary market is Southeast Asia, it will reached a revenue consumption volume of 131.09 B units in 2016.
There are major three classification of Lead Frame in this report: stamping process lead frame, etching process lead frame and others. Globally, the production share in 2015 of each type of Lead Frame is 45.98%, 34.01% and 20.01%, respectively.
At present, in developed countries, the Lead Frame industry is generally at a more advanced level. The world's large enterprises are mainly concentrated in Japan, Korea, Taiwan and China. The top three manufacturers are SH Materials, Mitsui High-tec, SDI, respectively with global production market share as 16.25%, 8.76%, 7.66% in 2015.
The worldwide market for Lead Frame is expected to grow at a CAGR of roughly 0.8% over the next five years, will reach 3990 million US$ in 2023, from 3800 million US$ in 2017, according to a new GIR (Global Info Research) study.

Market Segment by Manufacturers, this report covers
- SH Materials
- Mitsui High-tec
- SDI
- Shinko
- ASM Assembly Materials Limited
- Samsung
- POSSEHL
- I-Chiun
- Enomoto
- Dynacraft Industries
- DNP
- LG Innotek
- Kangqiang
- Hualong
- Jentech

Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
- Etching Process Lead Frame
- Stamping Process Lead Frame
- Others

Market Segment by Applications, can be divided into
- Integrated Circuit
- Discrete Device
- Other

There are 15 Chapters to deeply display the global Lead Frame market.
Chapter 1, to describe Lead Frame Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Lead Frame, with sales, revenue, and price of Lead Frame, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Lead Frame, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Lead Frame market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Lead Frame sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Published By: Global Info Research
Product Code: Global Info Research404430


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