North America Electronic Packaging Materials Market by Manufacturers, Countries, Type and Application, Forecast to 2023

Published: May 2018
No. of Pages: 104
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Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.

Scope of the Report:
This report focuses on the Electronic Packaging Materials in North America market, especially in United States, Canada and Mexico. This report categorizes the market based on manufacturers, countries, type and application.
Market Segment by Manufacturers, this report covers
- DuPont
- Evonik
- EPM
- Mitsubishi Chemical
- Sumitomo Chemical
- Mitsui High-tec
- Tanaka
- Shinko Electric Industries
- Panasonic
- Hitachi Chemical
- Kyocera Chemical
- Gore
- BASF
- Henkel
- AMETEK Electronic
- Toray
- Maruwa
- Leatec Fine Ceramics
- NCI
- Chaozhou Three-Circle
- Nippon Micrometal
- Toppan
- Dai Nippon Printing
- Possehl
- Ningbo Kangqiang

Market Segment by Countries, covering
- Metal Packages
- Plastic Packages
- Ceramic Packages

Market Segment by Type, covers
- Semiconductor & IC
- PCB
- Others

Market Segment by Applications, can be divided into
- Semiconductor & IC
- PCB
- Others

There are 15 Chapters to deeply display the North America Electronic Packaging Materials market.

Chapter 1, to describe Electronic Packaging Materials Introduction, product type and application, market overview, market analysis by countries, market opportunities, market risk, market driving force;

Chapter 2, to analyze the manufacturers of Electronic Packaging Materials, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017;

Chapter 4, to show the North America market by countries, covering United States, Canada and Mexico, with sales, revenue and market share of Electronic Packaging Materials, for each country, from 2013 to 2018;

Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2013 to 2018;

Chapter 7, 8 and 9, to analyze the segment market in United States, Canada and Mexico, by manufacturers, type and application, with sales, price, revenue and market share by manufacturers, types and applications;

Chapter 10, Electronic Packaging Materials market forecast, by countries, type and application, with sales, price and revenue, from 2018 to 2023;

Chapter 11, to analyze the manufacturing cost, key raw materials and manufacturing process etc.

Chapter 12, to analyze the industrial chain, sourcing strategy and downstream end users (buyers);

Chapter 13, to describe sales channel, distributors, traders, dealers etc.

Chapter 14 and 15, to describe Electronic Packaging Materials Research Findings and Conclusion, Appendix, methodology and data source

Published By: Global Info Research
Product Code: Global Info Research397732


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