Plastics in Electronics Components: Technologies and Global Markets

REPORT HIGHLIGHTS

The global electronic components market reached 3.4 billion pounds in 2011. It is expected to reach 3.5 billion pounds in 2012 and it will further grow to 4.4 billion pounds by 2017, a compound annual growth rate (CAGR) of 4.7%
The thermoplastic market reached 2.3 billion pounds in 2011. It is expected to reach 2.5 billion pounds in 2012 and it will further grow to 3.1 billion pounds by 2017, a CAGR of 4.9%
The thermoset market is expected to reach nearly 1.1 billion pounds in 2012 and it will further grow to 1.3 billion pounds by 2017, CAGR of 4.3%

REPORT SCOPE

INTRODUCTION

OBJECTIVES

This study focuses on plastics usage in electronic components; however, it is not a review of the electronic industry but deals with development of resins and resin grades to meet requirements of these electronic products used in computers, telecommunications, automotive, and other major industries employing these electronic components.

SCOPE AND FORMAT

This study covers all electronic components where plastics are used to a significant extent in mostly molding electronic components and excludes fiber optics, wire and cable, enclosures, recording media, etc.  This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.

REASONS FOR DOING THE STUDY

Resin consumption in electronic components had been growing at rates well above the Gross Domestic Product (GDP) for many years.  Aside from the recent “economic recovery,” there has been continued demand for electronic products, proliferation of new technologies, and “handling” of environmental pressures brought to bear on the industry has resulted in the need, in many instances, for higher performance plastics for many electronic components.  Thus, it is appropriate for a new appraisal of this market at this time.

METHODOLOGY

A comprehensive review was undertaken of literature relating to resins used to produce electronic components, their applications, technology, markets and new developments.  Included in the review were supplier trade literature, texts, and monographs.  Unresolved issues were clarified by contact with those involved in the industry.

Table of Contents

Chapter- 1: INTRODUCTION
OBJECTIVES
SCOPE AND FORMAT
REASONS FOR DOING THE STUDY
METHODOLOGY
ABOUT THE AUTHOR
RELATED BCC REPORTS
BCC ONLINE SERVICES
DISCLAIMER

Chapter- 2: SUMMARY
SUMMARYSummary Table : GLOBAL ELECTRONIC COMPONENTS MARKET BY TYPE OF RESIN, THROUGH 2017
Summary Figure : GLOBAL ELECTRONIC COMPONENTS MARKET BY TYPE OF RESIN, 2011-2017

Chapter- 3: RESINS USED IN ELECTRONIC COMPONENTS   
OVERVIEW
TYPES OF RESINS
THERMOPLASTICS
THERMOSET RESINS

Chapter- 4: RECENT RESIN DEVELOPMENTS RELATED TO ELECTRONIC COMPONENTS   
DUPONT ACTIVITIES

Chapter- 5: TICONA ADVANCES   
BAYER MATERIAL SCIENCE DEVELOPMENT

Chapter- 6: ELECTRONIC COMPONENT PRODUCTS   
INTRODUCTION
ACTIVE DEVICES
ACTIVE/PASSIVE DEVICES
PASSIVE DEVICES
FOCUS OF THIS REPORT
DIELECTRIC PROPERTIES OF PLASTICS
RESIN CONSUMPTION
PRINTED CIRCUIT BOARDS (PCBS)
ELECTRONIC PACKAGING

Chapter- 7: MOLDED ELECTRONIC PRODUCTS   
OVERVIEW

Chapter- 8: RECENT PATENTS RELATED TO THE INDUSTRY   
SUMMARY OF MARKET ESTIMATES AND FORECASTS FOR ELECTRONIC DEVICES
Table 58 : TOTAL GLOBAL RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2017
Table 59 : TOTAL THERMOPLASTIC RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2017
Table 60 : TOTAL GLOBAL THERMOSET PLASTIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2017

Chapter- 9: CHANGES IN ELECTRONIC COMPONENT MANUFACTURE WHICH COULD IMPACT RESIN CHOICES   

Chapter- 10: APPLICATIONS AND INDUSTRY TRENDS   
OVERVIEW
SNAPSHOT OF THE ELECTRONIC DEVICE MARKET
EXAMPLES OF STATIONARY ELECTRONIC DEVICES
EXAMPLES OF MOBILE ELECTRONIC DEVICES
SPECIAL END-USE MARKET FOR PLASTIC ELECTRONIC COMPONENTS —AUTOMOTIVE UNDER-THE HOOD

Chapter- 11: TECHNOLOGY TRENDS RELATED TO ELECTRONIC COMPONENTS   
BACKGROUND
IMPORTANCE OF MINIATURIZATION
PACKAGING
CONCEPT OF MICROMOLDING
REPLACEMENT OF CERAMICS WITH PLASTICS
THIN-WALLING ELECTRONIC COMPONENTS
PRINTED ELECTRONICS

Chapter- 12: ELECTRONIC COMPONENT INDUSTRY OVERVIEW   
TOP ELECTRONIC INDUSTRY MANUFACTURERS
MARKETING ASPECTS

Chapter- 13: RESIN PRODUCERS   
OVERVIEW
MAJOR RESIN PRODUCERS SUPPLYING PRODUCT TO THE ELECTRONIC
COMPONENT MARKET

Chapter- 14: PRICING   
Table 65 : LIST PRICES FOR SELECTED RESINS USED TO MOLD ELECTRONIC COMPONENTS

Chapter- 15: MOLDERS OF ELECTRONIC COMPONENTS   
Table 66 : TOP ELECTRICAL/ELECTRONIC INJECTION MOLDERS

Chapter- 16: ENVIRONMENTAL ISSUES   
OVERVIEW
PRINTED CIRCUIT BOARD DISPOSAL
HALOGEN-FREE PRINTED CIRCUIT BOARDS
RECYCLING
ELECTRONIC INDUSTRY INTERFACE

Chapter- 17: TESTING AGENCIES AND REQUIREMENTS RELATED TO ELECTRONIC COMPONENTS   
OVERVIEW
FIRE PROTECTION STANDARDS FOR ELECTRONIC COMPONENTS
UNDERWRITERS LABORATORIES (UL)

Chapter- 18: SELECTED COMPANY PROFILES   
AOC, INC.
ASAHI KASEI CHEMICAL
ASHLAND SPECIALTY CHEMICALS
BASF
BAYER MATERIAL SCIENCE
CHEVRON PHILLIPS CHEMICAL
CYTEC INDUSTRIES, INC.
DSM ENGINEERING PLASTICS
DUPONT, INC.
EMS GRIVORY, INC.
HUNTSMAN ADVANCED MATERIALS
INTERPLASTIC CORPORATION
LOCTITE, INC.
MITSUBISHI ENGINEERING PLASTICS
QUANTUM COMPOSITES
ROGERS CORPORATION
SABIC INNOVATIVE PLASTICS
SOLVAY ADVANCED POLYMERS LLC
SUMITOMO BAKELITE NORTH AMERICA
TICONA, INC.
TORAY PLASTICS
VICTREX, USA, LTD.

Chapter- 19: ACRONYMS   

List of Tables

Summary Table : GLOBAL ELECTRONIC COMPONENTS MARKET BY TYPE OF RESIN, THROUGH 2017
Table 1 : FABRICATION METHODS AND USES FOR POLYSTYRENE
Table 2 : COMPARISON OF NYLON 6 AND NYLON 66 PROPERTIES
Table 3 : EXAMPLES OF NYLON RESINS USED TO MOLD ELECTRONIC COMPONENTS
Table 4 : GLOBAL NYLON MARKET FOR ELECTRONIC COMPONENTS, THROUGH 2017
Table 5 : GLOBAL PBT ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 6 : GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 7 : GLOBAL PPS ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 8 : GLOBAL POLYIMIDE ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 9 : MAJOR POLYCARBONATE PRODUCERS AND TRADE NAMED PRODUCTS
Table 10 : GLOBAL POLYCARBONATE ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 11 : GLOBAL POLYPHTHALAMIDE ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 12 : GLOBAL ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 13 : GLOBAL POLYSULFONE ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 14 : GLOBAL POLYMER ALLOY/BLEND ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 15 : GLOBAL FLUOROPOLYMER COMPONENT MARKET, THROUGH 2017
Table 16 : GLOBAL POLYKETONE ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 17 : GLOBAL TOTAL THERMOPLASTIC RESIN MARKET FOR ELECTRONIC COMPONENTS, THROUGH 2017
Table 18 : FIBER-REINFORCED THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
Table 19 : GLOBAL EPOXY RESIN ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 20 : GLOBAL POLYURETHANE ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 21 : GLOBAL PHENOLIC ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 22 : INGREDIENTS OF UNSATURATED POLYESTER FORMULATIONS IN DESCENDING ORDER OF COMMERCIAL USE
Table 23 : GLOBAL UNSATURATED POLYESTER COMPONENT MARKET, THROUGH 2017
Table 24 : GLOBAL DAP ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 25 : GLOBAL TOTAL THERMOSET RESIN ELECTRONIC COMPONENT MARKET, THROUGH 2017
Table 26 : DIELECTRIC CONSTANTS OF SELECTED MATERIALS
Table 27 : DIELECTRIC CONSTANTS FOR SELECTED THERMOPLASTICS
Table 28 : IMPORTANT TECHNICAL FACTORS TO CONSIDER WHEN SELECTING PCB SUBSTRATE MATERIALS
Table 29 : COMPARISON BETWEEN RIGID AND FLEX CIRCUIT BOARDS
Table 30 : TOTAL GLOBAL PCB MARKET BY RESIN TYPE THROUGH 2017
Table 31 : GLOBAL PCB MARKET BY THERMOSET RESIN THROUGH 2017
Table 32 : GLOBAL PCB MARKET BY THERMOPLASTIC RESIN, THROUGH 2017
Table 33 : ENCAPSULANTS – APPLICATION MODE, ADVANTAGES AND DISADVANTAGES
Table 34 : EPOXY ENCAPSULANT FORMULATIONS
Table 35 : SELECTED ENCAPSULANT SUPPLIERS
Table 36 : GLOBAL ELECTRONIC ENCAPSULATION MARKET BY RESIN TYPE, THROUGH 2017
Table 37 : GLOBAL ENCAPSULANT MARKET BY THERMOSET RESIN, THROUGH 2017
Table 38 : GLOBAL ENCAPSULATION MARKET BY THERMOPLASTIC RESIN, THROUGH 2017
Table 39 : DEMAND FOR PASSIVE ELECTRONIC COMPONENTS
Table 40 : SELECTED MANUFACTURERS OF HIGH DENSITY, MULTIPIN CONNECTORS
Table 41 : GLOBAL CONNECTOR MARKET BY RESIN, THROUGH 2017
Table 42 : GLOBAL CONNECTOR MARKET BY THERMOPLASTIC RESIN, THROUGH 2017
Table 43 : GLOBAL CONNECTOR MARKET BY THERMOSET RESIN, THROUGH 2017
Table 44 : GLOBAL SWITCH MARKET BY RESIN, THROUGH 2017
Table 45 : GLOBAL SWITCH MARKET BY THERMOPLASTIC RESINS, THROUGH 2017
Table 46 : GLOBAL SWITCH MARKET BY THERMOSET RESIN, THROUGH 2017
Table 47 : SELECTED BOBBIN MOLDERS
Table 48 : GLOBAL BOBBIN MARKET BY RESIN, THROUGH 2017
Table 49 : GLOBAL BOBBIN MARKET BY THERMOPLASTIC RESIN, THROUGH 2017
Table 50 : GLOBAL BOBBIN MARKET BY THERMOSET RESINS, THROUGH 2017
Table 51 : GLOBAL RELAY MARKET BY RESIN THROUGH 2017
Table 52 : GLOBAL RELAY MARKET BY THERMOPLASTIC RESIN, THROUGH 2017
Table 53 : GLOBAL RELAY MARKET BY THERMOSET RESIN, THROUGH 2017
Table 54 : TOTAL GLOBAL CAPACITOR MARKET BY THERMOPLASTIC RESIN, THROUGH 2017
Table 55 : OTHER GLOBAL ELECTRONIC COMPONENT MARKET BY RESINS, THROUGH 2017
Table 56 : GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOPLASTIC RESIN, THROUGH 2017
Table 57 : GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOSET RESIN, THROUGH 2017
Table 58 : TOTAL GLOBAL RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2017
Table 59 : TOTAL THERMOPLASTIC RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2017
Table 60 : TOTAL GLOBAL THERMOSET PLASTIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2017
Table 61 : HISTORICAL, CURRENT AND PROJECTED U.S. AUTOMOTIVE SALES
Table 62 : ESTIMATED HYBRID SALES FOR THE U.S.
Table 63 : TOP GLOBAL SEMICONDUCTOR COMPANIES—2010
Table 64 : TRADE NAMES OF SELECTED, KEY RESINS USED IN ELECTRONIC COMPONENTS AND RELATED ELECTRONIC PRODUCTS
Table 65 : LIST PRICES FOR SELECTED RESINS USED TO MOLD ELECTRONIC COMPONENTS
Table 66 : TOP ELECTRICAL/ELECTRONIC INJECTION MOLDERS
Table 67 : CRITERIA FOR UL 94V CLASSIFICATIONS
Table 68 : BURN SPECIFICATION FOR UL 04 MATERIAL RATINGS

List of Figures

Summary Figure : GLOBAL ELECTRONIC COMPONENTS MARKET BY TYPE OF RESIN, 2011-2017