North America Plating for Microelectronics Market by Manufacturers, Countries, Type and Application, Forecast to 2023

Published: March 2018
No. of Pages: 109
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Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

Scope of the Report:
This report focuses on the Plating for Microelectronics in North America market, especially in United States, Canada and Mexico. This report categorizes the market based on manufacturers, countries, type and application.
Market Segment by Manufacturers, this report covers
- DOW
- Mitsubishi Materials Corporation
- Heraeus
- XiLong Scientific
- Atotech
- Yamato Denki
- Meltex
- Ishihara Chemical
- Raschig GmbH
- Japan Pure Chemical
- Coatech
- MAGNETO special anodes
- Vopelius Chemie AG
- Moses Lake Industries
- JCU International

Market Segment by Countries, covering
- Electroplating
- Electroless
- Immersion

Market Segment by Type, covers
- Gold
- Zinc
- Nickel
- Bronze
- Tin
- Copper
- Others

Market Segment by Applications, can be divided into
- Gold
- Zinc
- Nickel
- Bronze
- Tin
- Copper
- Others

There are 15 Chapters to deeply display the North America Plating for Microelectronics market.

Chapter 1, to describe Plating for Microelectronics Introduction, product type and application, market overview, market analysis by countries, market opportunities, market risk, market driving force;

Chapter 2, to analyze the manufacturers of Plating for Microelectronics, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017;

Chapter 4, to show the North America market by countries, covering United States, Canada and Mexico, with sales, revenue and market share of Plating for Microelectronics, for each country, from 2013 to 2018;

Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2013 to 2018;

Chapter 7, 8 and 9, to analyze the segment market in United States, Canada and Mexico, by manufacturers, type and application, with sales, price, revenue and market share by manufacturers, types and applications;

Chapter 10, Plating for Microelectronics market forecast, by countries, type and application, with sales, price and revenue, from 2018 to 2023;

Chapter 11, to analyze the manufacturing cost, key raw materials and manufacturing process etc.

Chapter 12, to analyze the industrial chain, sourcing strategy and downstream end users (buyers);

Chapter 13, to describe sales channel, distributors, traders, dealers etc.

Chapter 14 and 15, to describe Plating for Microelectronics Research Findings and Conclusion, Appendix, methodology and data source

Published By: Global Info Research
Product Code: Global Info Research394905


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