Global Solder Ball Market by Manufacturers, Countries, Type and Application, Forecast to 2022

Published: November 2017
No. of Pages: 119
    ReportsandReports

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Scope of the Report:
This report focuses on the Solder Ball in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
- Senju Metal
- DS HiMetal
- MKE
- YCTC
- Nippon Micrometal
- Accurus
- PMTC
- Shanghai hiking solder material
- Shenmao Technology

Market Segment by Regions, regional analysis covers
- North America (USA, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Columbia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
- Lead Solder Ball
- Lead Free Solder Ball

Market Segment by Applications, can be divided into
- BGA
- CSP & WLCSP
- Flip-Chip & Others

There are 15 Chapters to deeply display the global Solder Ball market.

Chapter 1, to describe Solder Ball Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of Solder Ball, with sales, revenue, and price of Solder Ball, in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the global market by regions, with sales, revenue and market share of Solder Ball, for each region, from 2012 to 2017;

Chapter 5, 6, 7, 8 and 9, to analyze the key regions, with sales, revenue and market share by key countries in these regions;

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2012 to 2017;

Chapter 12, Solder Ball market forecast, by regions, type and application, with sales and revenue, from 2017 to 2022;

Chapter 13, 14 and 15, to describe Solder Ball sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Published By: Global Info Research
Product Code: Global Info Research389892


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