Supply Chain Opportunities In the Worldwide High Speed Electronics and Optoelectronics Systems

High-speed electronics means different things in different market segments. In wide area, metro and data networks, high speed refers to data transfer rates at 10Gbps or higher. In the mobile infrastructure markets, the fourth generation of technology known as 4G encompasses protocols such as LTE and WiMax which support data rates above 100Mbps. While in the automotive segment, a new “high-speed” communications protocol, FlexRay, operates at a mere 10Mbps.

The purpose of this report is to take a look at the key systems in the fixed, wireless and mobile sectors e.g. servers, switches, routers, base stations and telecom infrastructure equipment, and consider the impact of the evolution of these system architectures on PCB design and fabrication, inspection, low-loss laminates, connectors, board assembly, board test and IC packaging. This is followed through in an analysis that identifies the prospective challenges and emerging opportunities for all levels of the supply chain. The report contains technology roadmaps and also forecasts market demand for the key systems, high-speed PCBs and low-loss laminates

INTRODUCTION

Introduction
Background
Research Methodology

HIGH SPEED SYSTEM ARCHITECTURES AND MARKET DRIVERS

Introduction
Standard System Architectures
Proprietary System Architectures
High-End Routers
Optical Transport Equipment
High-End Servers
Data Storage and Network Switch
Wireless Base Station
Military and Aerospace
Automotive

HIGH-SPEED CIRCUIT BOARDS

Introduction
Trace Geometry and Copper Skin Effect
Impedance Control
Compensation Techniques
Connectors, Vias and PTHs
Laminate Key Attributes
Low-Loss Laminates
Price Factor
Environmental Issues
Assembly and Test
Lead-Free Assembly
Test Standards and Systems
Conclusions and Implications

ADVANCED SEMICONDUCTOR PACKAGING

Introduction
Substrate Constructions for IC Packages
Multilayer Build-Up Substrates
Coreless Substrate Constructions
Substrate Technology Trade-Offs
Embedded Circuit Substrate
Semiconductor and Package Test
Conclusions

OPTO-PCBs AND COUPLING

Introduction
Optical Backplane Technologies
Embedded Waveguide Formation Photolithography
Two Photon Initiation
Laser Ablation
Ion Implantation
Hot Embossing and Replication
Embedded Polymer Waveguide Materials
Optical Coupling
Board to Board Optical Interconnect
Chip-to-Chip Optical Interconnect
Optical Transceiver Modules
Transponders and Transceivers
Parallel Optical Transceivers
Optical Sub-Assemblies
Silicon Photonics
Summary

MARKET FORECASTS

Introduction
Computer and Datacom
Telecom – Wireless Base Transceiver Station
Combined Telecom/Datacom Market for Low-Loss Laminates
Other Markets for Low-Loss Laminates
Summary of Market Demand for High-Speed PCBs and Laminates
Opto-PCBs
Transceiver Modules
Advanced Flip Chip Substrates

CONCLUSIONS AND OPPORTUNITIES

Conclusion
Opportunities

APPENDIX

GLOSSARY